The Xilinx XC5VFX70T-2FFG1136C is a high-end member of the Virtex-5 FXT FPGA family, offering 71,680 logic cells, 5.46 Mb of block RAM, dual PowerPC 440 processor cores, and 16 high-speed serial transceivers in a 1136-pin FCBGA package. Built on 65 nm CMOS technology and operating at a core voltage of 1.0 V, this device delivers up to 550 MHz performance, providing a complete system-on-chip solution for the most demanding communications, networking, and embedded processing applications.

Architecture

The Virtex-5 FXT family uses the second-generation ASMBL (Advanced Silicon Modular Block) column-based architecture. The XC5VFX70T-2FFG1136C features 71,680 logic cells organised into 5,600 configurable logic blocks (CLBs), providing massive logic capacity for complex system designs. The device integrates two embedded PowerPC 440 processor cores, each operating at up to 550 MHz, enabling efficient software execution and hardware acceleration.

Memory and DSP Resources

The device incorporates 5,455,872 bits of block RAM, organised as 36-Kbit block RAM/FIFOs, enabling large on-chip data storage for high-bandwidth applications. The second-generation 25 x 18 DSP slices provide efficient digital signal processing acceleration for arithmetic functions and filtering algorithms. The device also integrates system monitor functionality for on-chip voltage and temperature monitoring.

High-Speed Connectivity

The device provides 640 user I/O pins supporting a wide range of single-ended and differential signalling standards through SelectIO technology with built-in digitally-controlled impedance. Sixteen high-speed serial transceivers support data rates up to 6.5 Gb/s, making the device suitable for PCI Express, Gigabit Ethernet, XAUI, and other high-bandwidth interfaces. The device includes PCI Express compliant integrated Endpoint blocks and tri-mode Ethernet MACs (Media Access Controllers).

Technical Specifications

Packaging and Environmental

The XC5VFX70T-2FFG1136C is housed in a 1136-pin FCBGA (Flip-Chip Ball Grid Array) package measuring 35 x 35 mm. The package is RoHS compliant and lead free. Moisture Sensitivity Level is MSL 4, requiring a floor life of 72 hours after opening — shorter than typical MSL 3 devices. This requires careful handling during PCB assembly. The device is supplied in tray packaging with 21 pieces per tray.

Development Support

The Virtex-5 FXT family is supported by Xilinx ISE Design Suite (ISE 14.7). The device is not supported by the newer Vivado toolchain, which targets 7-series and later devices. For the embedded PowerPC processors, the EDK (Embedded Development Kit) provides a complete software development environment. Programming is performed via JTAG (IEEE 1149.1) using standard cables.

Product Status

The XC5VFX70T-2FFG1136C is currently active and available from distributors. For new designs requiring similar performance with modern tool support, consider the Zynq-7000 SoC family or Kintex UltraScale devices, which offer integrated processor systems and improved power efficiency.